Flexible Printed Circuit
Rigid-Flex Board
Substrate-like PCB

Flexible Printed Circuit

Flexible Printed Circuit (FPC) is a highly reliable and excellent flexible printed circuit board made of polyimide or polyester film. FPC is favored for its light weight, thin thickness, and flexibility to bend and fold. It is widely used in automotive, medical, industrial control, communication, wearable, consumer electronics and other fields.

【ZECHENG ProductionCapacity】

Single, double, multi-layer FPC (up to 8 layers);

Our production process is divided into Panel to Panel and Roll to Roll, which is allowed us to provide solutions for small, medium and large volume to meet customers’ need;

Metallized hole filling & resin hole filling process;

Minimum aperture: 0.035mm;

Minimum line width/spacing: 0.035mm/0.035mm;

Any-layer blind and buried vias;

Impedance control;

Finished copper thickness: 1/3 ounce to 8 ounces (12um~280um);

Rigid-Flex Board

Rigid-Flex Board is a circuit board made of a combination of rigid and flexible board. The rigid area can be assembled with components, and the flexible area can be bent and connected to reduce the trouble of joints and the volume requirements of densely assembled products, while increasing the reliability of interconnection.

【ZECHENG ProductionCapacity】

Rigid-Flex Board (up to 10 layers);

Improve the performance of bending area by glue dispensing;

The highest aspect ratio: 10:1;

Various types of Rigid-Flex board provided, including conventional, L2 HDI, asymmetric structure, flexible area differentiation etc;

Metallized hole filling & resin hole filling process;

Impedance control;

Finished copper thickness: 1/3 ounce to 2 ounces (12um~70um);

Substrate-like PCB

Substrate-like PCB (SLP) is the next generation circuit board, which can shorten the line width/spacing from HDI's 40/40 microns to 30/30 microns. Our Modified Semi-Additive Process (mSAP) is based on how to overcome the problems of subtractive and additive methods in the production of fine line circuits. The mSAP process performs chemical copper on the substrate and forms a resist pattern on it. The pattern on the substrate is thickened by a sputtering process to remove the resist pattern, and then the excess chemical copper layer is removed by flash etching. The area of the film protection that is not thickened by electroplating is quickly removed during the differential etching process, and the remaining part forms a circuit.

【ZECHENG ProductionCapacity】

SLP Board (up to 20 layers);

Minimum line width/spacing: 0.025mm/0.025mm;

Minimum aperture: 0.020mm;

Die attach bond pitch: 0.12-0.18mm;

LCP material;

At R&D and sample stage currently, mass production is planned for 2022;

Assembly and test
ProcessItemsProcess capability of Mass production
Solder paste PrintingMaximum PCB size 450*370mm
Maximum weight of panel3kg
Actual printing accuracy25μm >2.0CPK
System calibration repeat accuracy±15μm >2.0CPK
Pressure detection of squeegeeloop control system
SPIMinimum detectable spacing of solder balls100μm
X-Y axis accuracy1μm
Error detection rate≤0.1%
Pick and placeRange of component sizesLaser 01005~-33.5mm  / Camera  50x150m
Maximum component height 25mm
Maximum component weight50g
Minimum BGA/CSP ball‘s spacing and diameter0.25mm,0.10mm
Accuracy of pick and place±50um ±0.05°
Range of panel sizes50*50mm—950*370 mm
Range of the boards thickness0.3-4mm
Maximum weight of panel3kg
Maximum types of materials240
AOISmallest component01005
Defect typesWrong material,Component missing,Reversed,Misaligned,
Tombstone,Billboard,Unsolder,Solder short,Overturned
Detection of solder joint lift2D
ReflowAccuracy of temperature±1℃
Soldering protectionNitrogen protection(Amount of Residual oxygen<1000ppm)
Nitrogen controlNitrogen closed-loop automatic control system, ±500ppm
PreprocessAutomatic Forming Technology of componentsAutomatic forming of components
De-panelDe-panel typePunching and die cutting (FPC /PCB),  Laser cutting (FPC), CNC Routing (PCB)
AccuracyDie cutting :WEDM-LS(Wire cut Electrical Discharge Machining-Low Speed)±0.02mm, WEDM-HS(Wire cut Electrical Discharge Machining-High Speed)±0.05mm
Laser cutting: ±0.02mm
Maximum size of panelDie cutting :500*350mm
Laser cutting:  350*500mm
DIPDIP technologyManual
Wave-SolderingWave solderingSelective wave soldering
Inclination angle of transport guide rail
Temperature accuracy of General wave soldering±3℃
Steady accuracy of Selecting wave soldering±0.1mm
Soldering protectionNitrogen protection
Coating technologyMaximum Panel size 450*400*8mm
Maximum weight of single board25mm
Minimum nozzle diameterThe minimum nozzle diameter is 0.7mm,  selected according to the product.
Other characters  Double-head spraying,  spraying path,  residence time,  etc. can be controlled by the program.
The technology can identify the front and back of the board and has the Fool-proofing function.
Hot-BarPitchMinimum clearance: 0.2mm
MaterialsACF (Anisotropic Conductive Film) and solder paste
Peeling strengthAccording to the product soldering pad size and materials to determine
ICTTest levelsComponent level testing.Test the connection status of the hardware.
Number of test pointsThe standard number of test points is 320 and the maximum number is 4096
Test contentsContact test,  Open-Short test,  Resistance and capacitance test,  Second and third level FET(Field Effect Transistor) test,  No-power mixed test, Boundary scan chain test,  Power-on mixed mode test
Water washMaximum width of panel450mm
Maximum height of panel100mm
Equipment functionSingle\Double Hurricane Jet, S-type nozzle, Electric air knife , Temperature, Time control
Product seriesAutomobile productsAutomobile Electric Power Steering 、Automobile camera system components、 Automobile interior light components.
Consumer ElectronicsFingerprint module、Headphone/Speaker module、Touch module.
Medical productsSpirometer、Blood glucose detector、Eye treatment device、Oximeter.
FT(Functional Test)Test levelAcoustic audio test , Network microwave measurement, Test in magnetic field
Temperature cycle testTemperature rangeTemperature -60-150℃
Temperature rise and fall rate>10℃/min
Temperature deviation
Temperature ±2℃
Other reliability analysis tests
Aging test, Drop test, Vibration test,  Salt spray test,  Ion pollution test, Button life test